Axcelis to Showcase Enabling Implant and Plasma Cleaning Solutions at SEMICON China 2012
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- Optima XEx™ high energy implanter is the world's #1 high energy system, featuring the broadest energy range and highest beam currents for unmatched productivity. Its unique endstation and LINAC beamline ensures the industry's lowest metals levels, for superior image sensor performance.
- Optima HDx™ high current implanter's enabling spot beam technology combined with its proprietary wafer temperature control delivers higher yields and profitability critical for today's challenging device manufacturing environment. The system features the new Eterna ELS3 source, designed to extend source life by an unprecedented 500% improvement for Carbon, and a 300% improvement for Germanium applications for shallow junctions in sub 2Xnm nodes.
- Optima MDxt™ mid current implanter is an exciting new entrant to the market, delivering unmatched levels of productivity and energy purity across the broadest range of medium current implant applications. Its precision angle control, patented energy filter and constant focal length scanning minimizes device performance variation, providing the highest yield possible.
- Integra ES™ plasma cleaning system is the only product on the market capable of delivering enhanced device performance benefits with production-proven, non-oxidizing processes, to maximize dopant retention for sub-2Xnm logic devices. The system also features an innovative, modular, cluster design for outstanding manufacturing flexibility and speed for optimized return on your equipment investment.
The company is also participating in the
CSTIC 2012 Highlights
Symposium VI: Materials and Process Integration for Device Interconnection
A Comprehensive Study of Low Temperature and Molecular Carbon Implantation for sub-28nm Device Fabrication, by
Symposium III: Dry & Wet Etch and Clean
Study of Post Plasma Doping Photoresist Strip, by
Company Contacts:
maureen.hart@axcelis.com
jay.zager@axcelis.com
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