Axcelis Announces Purion Platform Showcase At SEMICON Korea 2016

January 25, 2016 at 8:00 AM EST
Purion Platform Emerging as Powerful New Standard for Delivering Highest Level of Precision and Manufacturing Flexibility

BEVERLY, Mass., Jan. 25, 2016 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced today that it will showcase its Purion™ Platform of ion implanters at SEMICON Korea 2016.  The event, one of the most important technology forums in the Asia Pacific region, is being held January 27-29, at the COEX Center in Seoul, Korea.  It will feature over 500 companies from 20 countries and is expected to draw over 40,000 attendees.

John Aldeborgh, executive vice president of customer operations, commented, "Korea is projected to be one of the largest and most dynamic markets for semiconductor fab equipment in 2016, and is an area of strategic focus for Axcelis as we continue to expand our market share. As they transition to support rapid growth in IoT, data collection and storage markets, they can rely on the Purion platform as the new standard in dopant precision and manufacturing flexibility."

Axcelis Purion Showcase:
Korean chip manufacturers are invited to visit the Axcelis Purion Showcase at Booth #5504 in Hall D to learn firsthand about the technical and manufacturing breakthroughs of the industry's first complete implant platform designed specifically for the advanced planar and 3D devices.  This includes:

  • Purion XE™, the industry standard for high energy implant. This product includes a new extended energy range option to perform ultra-high energy implants. This new option was developed specifically to address the emerging needs of the image sensor, power device and NAND markets.
  • Purion H™ high current implanter, with the fastest growing market share of any implanter in Axcelis history. It features the industry's most advanced scanned spot beam technology which enables precise control of damage engineering and enhanced device performance.
  • Purion M™ mid current implanter, which now includes new capabilities to handle 150mm to 300mm wafers as well as multiple substrates for specialty device manufacturing. In addition, the Purion M's 'green design' ensures the industry's lowest level of power consumption for reduced environmental impact and lower operating costs.

About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry for over 35 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at www.axcelis.com.

CONTACTS:
Maureen Hart (editorial/media) 978.787.4266
Doug Lawson (investor relations) 978.787.9552

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SOURCE Axcelis Technologies, Inc.