Axcelis Features Purion Platform Interactive Tour At SEMICON Korea 2017
Chip manufacturers are invited to step inside the Purion platform with an interactive 3D virtual tour where they can view the platform's significant technology and manufacturing advantages. This includes:
- Purion XE™, the industry standard for high energy implant. This product line now includes the new Purion VXE™ and Purion EXE™ extended energy range options to perform ultra-high energy implants up to 8 MeV. These new models were developed specifically to address the emerging needs of the image sensor, power device and NAND markets.
- Purion H™ high current implanter, which features the industry's most advanced scanned spot beam technology to enable precise control of damage engineering and enhanced device performance. It now includes the new Eterna ELS4, that delivers up to 50% improvement in lifetime and stability for lowest possible CoO.
- Purion M™ mid current implanter, which features a unique hybrid filtration technology that eliminates energetic metallic contamination with same mass to charge ratio as implant species. The system handles 150mm to 300mm wafers as well as multiple substrates for specialty device manufacturing.
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