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Axcelis Ships The Second 'Purion H' High Current Implanter To Leading Chipmaker In Asia Pacific Region
Second Chipmaker to Install the Complete Purion Platform to Leverage Industry's Most Innovative Implant Technology Across the Full Applications Space

BEVERLY, Mass., Sept. 11, 2014 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of innovative, high-productivity solutions for the semiconductor industry, announced today that it has shipped the second Purion H™ high current implanter  to one of the world's leading chipmakers in the Asia Pacific region. This is the second major chipmaker to install the complete Purion Platform. The Purion H joins the Purion M™ and Purion XE™ which are already in production at the customer site. The Purion H will be used to manufacture next generation memory devices, and to develop new FLASH and Logic devices. The system shipped in early September.

The Purion H ushers in a revolutionary new era of high performing implant technology, elevating what customers will come to expect from high current implanters. A few of its many new and innovative features include: Next generation scanned spot beam technology with precision implant angle and dose control to enhance device performance and yield; Enabling process control technology to minimize all forms of contaminants to ensure absolute beam purity...

John Aldeborgh, executive vice president, customer operations, commented, "We're very excited about this new win and the opportunity to expand our high current market presence. The Purion H's innovative magnetically scanned spot beam expands the traditional high current implant space; bringing new capabilities for low dose, low energy applications. With the addition of the Purion H, this customer will be able to leverage the full power of the Purion platform across the complete ion implant application space and develop new manufacturing strategies to boost device yield and capital efficiency. The Purion is the only platform specifically designed to address our customers' most stringent requirements for advanced planar and emerging 3D devices."

The Power of Purion
The Purion platform redefines the ion implanter application space, delivering unmatched purity, precision and productivity to enhance customers' device performance and yield. On this platform, Axcelis has built the industry's first complete implant product solution designed specifically for advanced planar and 3D devices while providing the most flexible and productive manufacturing capability for our customers. The systems' common cross-product platform architecture is designed to drive manufacturing flexibility and lower the total cost of fab operations. All Purion implanters incorporate Axcelis' industry leading Purion Contamination Shield™ Defense System, for unsurpassed implant quality, so even the most sensitive devices can realize optimized device performance. The platform's proprietary Purion Vector™ dose and angle control system, and constant focal length scanning deliver the most precise and repeatable dopant placement available today. The platform's superior beam current performance combined with the Purion™ 500wph end station provides the industry's highest productivity. The Purion platform includes the Purion M™ medium current implanter, the Purion H™ high current implanter, and the Purion XE™ high energy implanter.

About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry for over 35 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at www.axcelis.com.


Maureen Hart (editorial/media) 978.787.4266
Doug Lawson (investor relations) 978.787.9552

Photo - http://photos.prnewswire.com/prnh/20140910/145135

Logo - http://photos.prnewswire.com/prnh/20130905/NE75070LOGO

SOURCE Axcelis Technologies, Inc.


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