Axcelis Introduces Advanced RTP System for 300mm Production; Summit 300XT Meets Uniformity Needs for Thermal Processing Beyond the 100nm Technology Node
"The Summit 300XT was designed to address both the technical and economic challenges associated with 300mm manufacturing," said David Duff, director of marketing for Axcelis' ion implantation and rapid thermal processing group. "Technologists are drawn to the tool's industry-leading thermal performance and state-of-the-art temperature measurement and control system, while manufacturing management is eager to reap the demonstrated uniformity, repeatability and yield benefits. This combination of technology roadmap alignment and manufacturing excellence makes the Summit 300XT truly enabling for the 300mm high-volume manufacturing ramp."
Additionally Duff commented, "In tandem with the Axcelis HC3 300mm high current implanter, the Summit 300XT provides the precise process control and superior manufacturing capability required for ultra shallow junction formation." In a separate announcement today, Axcelis introduced the HC3 300mm high current implanter.
As with the entire Summit Series, the Summit 300XT features an inherently uniform thermal environment, repeatable processing and simplicity of design. The Summit 300XT features PrecisionTempPlus, a patented, predictive, "feed-forward," model-based temperature control system. A real-time model for wafer temperature is embedded in the PrecisionTempPlus control algorithm, giving the system a look-forward capability that allows extremely accurate temperature trajectory tracking. This feed-forward control approach provides superior spike anneal performance relative to the lamp RTP feedback systems based on conventional proportional derivative "PID" control.
In addition, the system provides accurate and repeatable emissivity independent temperature measurement, combined with closed loop temperature control. The enhanced hot wall isothermal design produces repeatable within-wafer and wafer-to-wafer uniformity, resulting in excellent process yields. With a throughput of 105 wafers-per-hour and improved wafer handling, the Summit 300XT offers a significant cost-of-ownership advantage over competing lamp-based annealing systems.
The Summit 300XT patented temperature measurement capability enables a broad temperature range from 275 to 1200(degree)C. This gives both logic and memory device makers the ability to cover the full array of advanced thermal processing applications, including anneals for ultra shallow junctions, dry and wet oxidation, silicides, shallow trench isolation (STI) oxides, copper, and high- and low-k dielectrics. Designed for ease of use and the "copy exact" requirements of IC manufacturing, the system is a highly productive and flexible tool that eliminates the need for test wafer use or system calibration.
The tool will be on display at the SEMICON West tradeshow being held July 16-20, 2001 at San Francisco's Moscone Center. Customers and press are invited to visit the Axcelis booth, number 734 in the South Hall, at any time during the show.
About Axcelis Technologies, Inc.Axcelis Technologies, Inc., headquartered in Beverly, Massachusetts, provides innovative, high-productivity manufacturing solutions for the semiconductor industry. Axcelis is dedicated to the design and manufacture of high current, medium current and high energy ion implantation equipment; rapid thermal processing systems; and photostabilization and photoresist stripping equipment. Axcelis Technologies has manufacturing facilities in Beverly and Rockville, Maryland, as well as in Toyo, Japan through its joint venture Sumitomo Eaton Nova. The Company's Internet address is http://www.axcelis.com.
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