Axcelis Receives Follow-on Order from UMC for RadiantStrip Low-K Cleaning Platform; Patented Zero-Damage Cleaning System Selected as Process Tool of Record for Taiwan Foundry

BEVERLY, Mass., Oct 17, 2005 (BUSINESS WIRE) -- Axcelis Technologies, Inc. (NASDAQ: ACLS) has received a follow-on order for its RadiantStrip 320Lk photoresist dry strip and cleaning system from Taiwan's UMC, one of the largest semiconductor foundries in the world. The company chose Axcelis' RadiantStrip 320Lk system - which is known for its ability to remove resist and residue without damaging sensitive low-k dielectric structures - as the process tool of record for the foundry.

At the core of the RadiantStrip 320Lk is Axcelis' patented zero-damage He:H(2) process, which enables damage-free back-end-of-line cleaning through the 45nm technology node. The system has been proven to effectively clean critical interconnect structures without eroding low-k materials performance or causing unwanted copper oxidation. Unlike conventional dry strip technologies, Axcelis' He:H(2) process does not introduce latent damage in low-k materials; such damage typically leads to adverse changes in a dielectric's insulating properties and physical characteristics. The system will ship to UMC's Fab 12A in Tainan, Taiwan by the end of 2005.

"UMC's selection of the RadiantStrip 320Lk speaks volumes about the tool's ability to simplify some of the industry's toughest low-k integration challenges. Our He:H(2) process is unlike any other strip technology available - no other platform is capable of protecting delicate low-k structures while still producing an efficient, reliable clean," said Mary Puma, chairman and CEO of Axcelis. "It is for this reason that the system continues to see wide acceptance with low-k customers around the globe."

The RadiantStrip 320Lk is based on Axcelis' field-proven 300mm platform. A stand-alone dry strip system, the tool offers up to 25 percent lower cost of ownership compared to integrated (in situ) etch/strip approaches. The RadiantStrip 320Lk's downstream microwave chamber design provides consistent strip rates, excellent process uniformity and high selectivity to low-k materials.

The RadiantStrip 320Lk was born out of nearly five years of focused research and collaboration with customers and suppliers of low-k materials.

About UMC

UMC (NYSE: UMC, TSE: 2303) is a leading global semiconductor foundry that manufactures advanced process ICs for applications spanning every major sector of the semiconductor industry. UMC delivers cutting-edge foundry technologies that enable sophisticated system-on-chip (SoC) designs, including 90nm copper, 0.13um copper, and mixed signal/RFCMOS. UMC is also a leader in 300mm manufacturing; Fab 12A in Taiwan and Singapore-based Fab 12i are both in volume production for a variety of customer products. UMC employs approximately 10,500 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com.

About Axcelis Technologies, Inc.

Axcelis Technologies, Inc., headquartered in Beverly, Massachusetts, provides innovative, high-productivity solutions for the semiconductor industry. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation, rapid thermal processing, and cleaning and curing systems. Axcelis Technologies has key product development centers in Beverly, Massachusetts, as well as in Toyo, Japan through its joint venture, SEN. The company's Internet address is: www.axcelis.com.

Forward-Looking Statements

This press release includes certain statements, known as "forward-looking statements," which express the current expectations of Axcelis management. Product manufacturing and delivery issues, customer order push-outs or cancellations and product performance could cause actual results to differ materially from those currently anticipated as expressed in this press release. These risks and other risk factors relating to Axcelis are described more fully in the most recent Form 10-K filed by Axcelis and in other filings from time to time with the Securities and Exchange Commission.

SOURCE: Axcelis Technologies, Inc.

Company Contact:
Axcelis Technologies, Inc.
Maureen Hart, 978-787-4266
Fax: 978-787-4275
maureen.hart@axcelis.com
or
Investor Contact:
Axcelis Technologies, Inc.
James Kawski, 978-787-4000
Fax: 978-787-9133
investor.relations@axcelis.com
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Agency Contact:
Loomis Group
Heather Smith, 617-638-0022
Fax: 617-638-0033
smithh@loomisgroup.com