Axcelis Teams With SEZ to Develop Dry/Wet Cleaning Processes

BEVERLY, Mass.--(BUSINESS WIRE)--June 19, 2001--Axcelis Technologies, Inc., (NASDAQ: ACLS), and the SEZ Group (SWX: SEZN), Villach, Austria, have begun a development partnership to study the benefits of integrating dry and wet cleaning technologies. The initial work will concentrate on optimizing combined dry and wet cleaning processes for resist strip and residue removal as they apply to copper/low-k, and dual-damascene applications. The joint development program is expected to lead to more efficient, cost-effective cleaning processes for advanced IC manufacturing.

"The chip industry is rapidly adopting copper, low-k dielectrics and other complex new materials as we move toward future device generations. This presents tremendous cleaning challenges that we think will be best tackled by optimizing dry and wet processes together, rather than individually," said Michael West, vice president of strategic business development for SEZ. "Our goal is to decrease chemical usage while improving cleaning process cycle times and overall cost of ownership. Together we are a formidable team -- we're combining Axcelis' experience in dry plasma cleaning, SEZ's expertise in single-wafer wet Spin-Process technology, and both companies' leadership in the 300mm market, where advanced cleaning technologies will be deployed."

Under the development alliance, Axcelis and SEZ will investigate the cost and performance advantages of optimizing the combined dry strip and wet clean operations for FEOL and BEOL photoresist removal and post etch cleaning. The initial phase of the development alliance will concentrate on low-k, copper, and dual-damascene processes. As the program develops, the companies expect to explore the benefits of combined dry and wet processing approaches for cleaning challenges associated with low-k dielectrics and other advanced materials.

"Until now, the development and integration of dry and wet cleaning processes have been integrated into low-k and Cu device structures fairly independently of each other. If we link these processes, we can develop an enhanced cleaning method that is more powerful than either approach alone, particularly given the increased material and structural complexity," said Michael Dreyer, vice president and general manager of Axcelis Technologies' Photoresist Processing Group. Dreyer said the companies have already seen examples where combined dry and wet processing approaches can reduce process times and improve process results considerably.

"We're excited about working with SEZ, which has an excellent reputation for executing on key R&D programs that consistently translate to viable manufacturing technologies," Dreyer added. "This partnership reflects our dedication --that of both SEZ and Axcelis-- to developing sure-fire solutions to some of the industry's toughest cleaning challenges."

About the SEZ Group

The SEZ Group is a leading supplier of wet wafer surface preparation equipment to the global semiconductor manufacturing industry. The company's breakthrough proprietary Spin-Processor technology forms the basis of a broad portfolio of single wafer backside and frontside wafer surface conditioning products for semiconductor chipmakers worldwide. Additionally, the company offers a complete range of wet bench equipment for batch processing. SEZ maintains development, manufacturing, sales, marketing and service operations in Europe, Asia and North America. Registered in Zurich, Switzerland, SEZ Holding AG is listed on the Swiss Exchange under the symbol "SEZN." SEZ also can be found on the world wide web at http://www.sez.com.

About Axcelis Technologies, Inc.

Axcelis Technologies, Inc., headquartered in Beverly, Massachusetts, provides innovative, high-productivity manufacturing solutions for the semiconductor industry. Axcelis is dedicated to the design and manufacture of high current, medium current and high energy ion implantation equipment; rapid thermal processing systems; and photostabilization and photoresist stripping equipment. Axcelis Technologies has manufacturing facilities in Beverly and Rockville, Maryland, as well as in Toyo, Japan through its joint venture Sumitomo Eaton Nova. The Company's Internet address is http://www.axcelis.com.

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