Axcelis Wins Follow-On Order for 300mm Implant and Strip Tools; Sale of Axcelis HE3 and FusionES3 Systems Affirms Axcelis' 300mm Market Leadership

BEVERLY, Mass.--(BUSINESS WIRE)--Sept. 5, 2001--Axcelis Technologies, Inc. (NASDAQ: ACLS), today announced that it has won a follow-on order for its 300mm high energy implant and photoresist removal systems from a major U.S. chipmaker. Expanding this customer's installed base of Axcelis' 300mm tools, the multi-million dollar order includes the Axcelis HE3 high energy ion implanter and FusionES3 dry strip systems. Tool shipments are expected to begin in the third quarter of 2001.

"This order highlights Axcelis' leadership in the 300mm market. The Axcelis HE3 and FusionES3 have been adopted by 300mm fab lines worldwide, and share an outstanding reputation as high-productivity platforms with superior cost-of-ownership benefits. Backed by our strong global customer and applications support programs, these second-generation systems enable customers to make a smooth transition to volume 300mm manufacturing," said Mary Puma, president and COO of Axcelis.

Both the Axcelis HE3 and the FusionES3 are designed to meet the rigors of high-volume manufacturing in the 300mm wafer/100nm device era. The Axcelis HE3 covers the broadest range of advanced applications - from retrograde wells, triple wells and other high energy implants, to lower-energy channel stop and Vt-adjust implants. The FusionES3 combines comprehensive, damage-free dry resist and residue removal in a single chamber, offering a highly reliable post-implant and post-etch strip process.

About Axcelis Technologies, Inc.

Axcelis Technologies, Inc., headquartered in Beverly, Massachusetts, provides innovative, high-productivity manufacturing solutions for the semiconductor industry. Axcelis is dedicated to the design and manufacture of high current, medium current and high energy ion implantation equipment; rapid thermal processing systems; and photostabilization and photoresist stripping equipment. Axcelis Technologies has manufacturing facilities in Beverly and Rockville, Maryland, as well as in Toyo, Japan through its joint venture Sumitomo Eaton Nova. The Company's Internet address is http://www.axcelis.com.

Forward-Looking Statements

This press release includes certain statements, known as "forward-looking statements," which express the current expectations of Axcelis management. Certain risks and uncertainties could cause actual results to differ materially from those currently anticipated as expressed in this press release. Among other factors, such risks and uncertainties include the continuing demand for semiconductor equipment, relative market growth, continuity of business relationships with major customers, competitive pressure on sales and pricing, increases in material and other production costs that cannot be recouped in product pricing and global economic and financial conditions. These risks and other risk factors relating to Axcelis are described more fully in the most recent Form 10-K filed by Axcelis and in other filings from time to time with the Securities and Exchange Commission.

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