Axcelis Wins Follow-On Order for GSD Ultra Low Energy High Current Ion Implanter
BEVERLY, Mass., Sep 3, 2003 (BUSINESS WIRE) -- Axcelis Technologies, Inc. (NASDAQ: ACLS) has received another order for its GSD Ultra ion implanter, a multi-wafer system used to produce ultra shallow junctions and other advanced transistor structures in semiconductor devices. The customer, a leading North American chipmaker, ordered the system for its process development fab following the installation of multiple HC3 Ultra systems and its first GSD Ultra system last year.
"Axcelis' Ultra systems have quickly become the preferred low energy, high current implanters for this customer - and at fabs worldwide - because they offer the productivity needed for volume production of ultra shallow junctions in advanced technology nodes," said Mike Luttati, Axcelis' chief operating officer. "After a rigorous evaluation of the Ultra's capabilities, our customer chose the platform for both process development and mass manufacturing. This order is a testimony to the trust and confidence our customers have in Axcelis to meet their requirements through the 65nm technology node."
The GSD Ultra is Axcelis' newest low energy, high current implanter. Since its introduction last year, the GSD Ultra has seen steady, rapid adoption by the industry's leading chipmakers. The multi-wafer system offers a highly productive platform for producing ultra shallow junctions and other advanced transistor structures on a volume scale. The GSD Ultra uses Axcelis' new Ultra low energy beamline to shorten implant times, resulting in greater throughput and high current process productivity. The Ultra delivers exceptional beam currents in drift mode, and the system's multi-wafer platform allows for a short, simple and efficient beamline, providing the best option for achieving excellent uniformity and process control. An innovative packaging design also provides easy maintenance access and maximum tool uptime.
This latest order expands the customer's installed base of Axcelis' low energy, high current implanters, resulting in a full complement of tools for producing transistor structures. Axcelis recently installed the GSD Ultra at the customer's process development fab, following the installation of the first GSD Ultra at the facility in November 2002. The customer has also purchased Axcelis' HC3 Ultra, a low energy, high current tool for 300mm manufacturing, as well as Axcelis' HE3 ion implanter, which uses higher energies to produce well and channel implants in 300mm wafer production.
About Axcelis Technologies, Inc.
Axcelis Technologies, Inc., headquartered in Beverly, Massachusetts, provides innovative, high-productivity solutions for the semiconductor industry. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation, rapid thermal processing, and cleaning and curing systems. Axcelis Technologies has key technology centers in Beverly, Massachusetts, and Rockville, Maryland as well as in Toyo, Japan through its joint venture, SEN. The company's Internet address is: www.axcelis.com.
Forward-Looking Statements
This press release includes certain statements, known as "forward-looking statements," which express the current expectations of Axcelis management. Certain risks and uncertainties could cause actual results to differ materially from those currently anticipated as expressed in this press release. Among other factors, such risks and uncertainties include the continuing demand for semiconductor equipment, relative market growth, continuity of business relationships with major customers, competitive pressure on sales and pricing, increases in material and other production costs that cannot be recouped in product pricing and global economic and financial conditions. These risks and other risk factors relating to Axcelis are described more fully in the most recent Form 10-K filed by Axcelis and in other filings from time to time with the Securities and Exchange Commission.
SOURCE: Axcelis Technologies, Inc.
Company Contact: Axcelis Technologies, Inc. David Snyder, 978-787-4273 david.snyder@axcelis.com or Investor Contact: Axcelis Technologies, Inc. Mark Namaroff, 978-787-4000 investor.relations@axcelis.com or Agency Contact: Loomis Group Stacy Grisinger, 617-638-0022 grisingers@loomisgroup.com
http://www.businesswire.com
Today's News On The Net - Business Wire's full file on the Internet with Hyperlinks to your home page.
