Leading 300mm DRAM Fab Orders Axcelis' FusionPS3 Photostabilizers; Systems Enable Improved Process Control in Etch and High-Dose Implant Applications

BEVERLY, Mass., Mar 19, 2002 (BUSINESS WIRE) -- Axcelis Technologies, Inc., (NASDAQ: ACLS), today announced an order for two FusionPS3 300mm photostabilizers from a leading European DRAM chipmaker. Building on their already large install base of 200mm systems, the FusionPS3 systems will be used to improve process control in etch and high-dose implant applications on the customer's 300mm manufacturing line. Final tool installation is expected to be complete in the first quarter of 2002.

"As the photostabilization market leader, Axcelis seeks to consistently deliver new and innovative resist curing processing advantages to the market. Axcelis' FusionPS3 systems offer a reliable, cost-efficient 300mm platform for both deep UV and i-line resist photostabilization, giving chip manufacturers a production-proven method for improving process control in and beyond the 130nm technology node," said Jan Paul van Maaren, vice president and general manager of Axcelis Technologies' Curing and Cleaning Systems. "For many years, Axcelis' photostabilizers have helped our customers increase critical dimension control in etch and implant applications. The FusionPS3 allows for the easy transfer of proven process recipes to minimize the risk of moving from 200mm to 300mm manufacturing."

Recognized for its ability to improve device quality and increase wafer yields, Axcelis' photostabilization technology supports the integration of advanced materials into mainstream chip manufacturing. When used prior to etch processing, photostabilization of resists increases critical dimension control, improves resist/layer etch selectivity and minimizes process variations. Axcelis photostabilizers also demonstrate significant advantages in high-dose ion implant applications, where photostabilization of resists improves implant quality and enables shorter processing time in subsequent dry resist strip steps.

The industry's first and only 300mm photostabilizer, the FusionPS3 combines leading-edge resist curing capabilities on a dual-chamber platform. The system's design allows wafer-handling and auxiliary service modules to be operated side-by-side, with the flexibility for simultaneous processing of different recipes. Each chamber has full electrical and mechanical isolation. This allows operators to access one module for processing, while accessing the other for service. The result is maximum machine uptime, high throughput and low overall cost of ownership.

    About Axcelis Technologies, Inc.

Axcelis Technologies, Inc., headquartered in Beverly, Massachusetts, provides innovative, high-productivity solutions for the semiconductor industry. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation, rapid thermal processing, and cleaning and curing systems. Axcelis Technologies has key technology centers in Beverly, Massachusetts, and Rockville, Maryland as well as in Toyo, Japan through its joint venture, SEN. The company's Internet address is: www.axcelis.com.

CONTACT:          Company Contact:                    
                  Nicole York                         
                  Axcelis Technologies, Inc.          
                  Tel: +1 (301) 284 5841              
                  nicole.york@axcelis.com             
                  or
                  Investor Contact:                  
                  Mark Namaroff                      
                  Axcelis Technologies, Inc.         
                  Tel: +1 (978) 787 4000             
                  investor.relations@axcelis.com     
                  or
                  Agency Contact:           
                  Dave Snyder               
                  Loomis Group              
                  Tel: +1 (617) 638 0022    
                  snyderd@loomisgroup.com   

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