Major Chipmaker Selects Axcelis 300MM Implant and RTP Platforms; Multi-million Dollar Order Marks First Sale of Next Generation HC3 and New Summit 300XT Systems

BEVERLY, Mass., Jul 23, 2001 (BUSINESS WIRE) -- Axcelis Technologies, Inc. (NASDAQ: ACLS), today announced that a major North American IC maker has chosen Axcelis as a supplier-of-record for its first 300mm fab, where it will install a suite of Axcelis' 300mm HC3 high current and HE3 high energy ion implanters as well as Summit 300XT rapid thermal processing (RTP) tools. The multi-million dollar order follows the extensive evaluation of Axcelis 300mm equipment and marks the first sale of the second generation HC3 and the new Summit 300XT RTP systems. Initial tool shipments are expected to begin in the first quarter of 2002.

"The combination of Axcelis' implant and RTP process capability gives our customer a complete processing package for ultra shallow junction formation and other advanced applications," said Mike Luttati, senior vice president and general manager of the ion implantation and rapid thermal systems group of Axcelis. "It's gratifying to have our customer - a technology leader - validate the benefits of Axcelis' 300mm technology platforms. These implant and RTP systems were chosen because they offer proven reliability, the lowest cost of ownership, and superior process control."

Extendible beyond the 100nm technology node, the Axcelis 300mm suite of products offers a complete package of next-generation features built on a foundation of existing, production-proven 200mm technology. Axcelis' HE3, the industry's first high-energy implanter designed for 300mm manufacturing, provides the broadest range of implant energies, from 10keV to greater than 3MeV, extending the highest productivity coverage to medium current applications. The second generation HC3, introduced in June, offers reliable high current processing from 0.2 to 80keV; when used in conjunction with Axcelis' new Summit 300XT RTP platform for ultra shallow junction formation, the result is an exceptionally uniform and repeatable process that ensures both technology node alignment and manufacturing alignment for volume production.

    About Axcelis Technologies, Inc.

Axcelis Technologies, Inc., headquartered in Beverly, Massachusetts, provides innovative, high-productivity manufacturing solutions for the semiconductor industry. Axcelis is dedicated to the design and manufacture of high current, medium current and high energy ion implantation equipment; rapid thermal processing systems; and photostabilization and photoresist stripping equipment. Axcelis Technologies has manufacturing facilities in Beverly and Rockville, Maryland, as well as in Toyo, Japan through its joint venture Sumitomo Eaton Nova. The Company's Internet address is http://www.axcelis.com.

CONTACT:          Axcelis Technologies, Inc.
                  Elizabeth Burnside, +1 (978) 787-4273
                  elizabeth.burnside@axcelis.com
                  or
                  Axcelis Technologies, Inc.
                  Mark Namaroff, +1 (978) 787-4000
                  investor.relations@axcelis.com
                  or
                  Loomis Group
                  Gabrielle Svenning, +1 (617) 638-0022
                  gabrielle@loomisgroup.com