Axcelis Announces First Shipment Of 'Purion H200 SiC Power Series' Implanter
President and CEO
Executive Vice President of Product Development,
The Purion H200
The Purion H200 is the first and only single wafer high current implanter designed to cover all high dose implant applications from energies as low as 5keV to a maximum of 200keV, and is especially suited to foundry and power device manufacturers' needs. Built upon the industry-proven Purion H high current beamline with its unique scanned spot beam architecture, the Purion H200 delivers the productivity of high current tools with the precision and accuracy of medium current implanters.
Purion Power Series™
The Company's Purion Power Series was designed to meet the growing market demand for the power device market. The Purion Power Series was developed with enabling technology to specifically address the unique needs of emerging power device applications. This includes the flexibility to handle multiple wafer sizes from 150mm to 300mm as well as various substrates including Si and SiC, along with its precision wafer temperature control technology, all accomplished while delivering the industry's highest throughput and capital efficiency. The product line includes the Purion M Power Series™ for medium current, the Purion H Power Series™ and Purion H200 Power Series™ for high current and the Purion XE Power Series™ for high energy.
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