Axcelis Announces Participation in SEMICON Korea 2024
- Purion H™ Series - Including the Purion H5™ and the Purion Dragon™, both designed to provide a comprehensive solution for high current implants.
- Purion H200™ -
Axcelis'state of the art single wafer high current medium energy implanter, designed to address the unique implant needs for devices designed for the Internet of Things (IoT) and power applications.
- Purion XE™ Series - The industry leading high energy implant platform, including the Purion XEmax featuring patented Boost Technology™ and designed for the most advanced image sensor applications.
- Purion M™ Series - Offering the broadest spectrum of medium current application coverage available, enabling unparalleled flexibility to meet today's evolving implant requirements.
- Purion Power Series™ - Featuring innovative solutions for processing across the full power device application space and ability to handle all wafer types including silicon, silicon carbide (SiC) and thin.
- Innovative Augmented Reality (AR) Solutions - Showcasing the Company's state of the art AR system utilizing Microsoft HoloLens mobile holographic technology to enable remote training, service, testing and troubleshooting. See firsthand how the system allows customers and
Axcelistechnicians to collaborate instantaneously.
During the show,
STS (SEMI Technology Symposium)
S2. Advanced Materials & Process Technology Journey to Future Device Revolution through Disruptive Materials & Process Technology
Wide Bandgap Semiconductor Doping Technologies
SiC Power Semiconductor Summit
Silicon Carbide Doping Technology
President and CEO of Axcelis Technologies
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